Aluminum and Other Metals
2-Ethenol, 2-Nitrilotriethenol, Ammonium Tetrafloroborate,2-Iminodiethenol, Tetrafluoroboric Acid, Zinc Bis, Tin Bis, Zinc Oxide
350 to 550 deg f
7 to 9
Stay Clean® is an active flux formulation designed for soldering aluminum and joining aluminum to other metals. The flux is formulated with amines and complex inorganic fluorides and was designed for use with Harris® Al-Solder™ 500. It is also a good choice for use with other tin based solders that have a suitable melting temperature. During the initial heating process, it is important to avoid directing the flame on the flux. Heat should be directed adjacent to the flux while allowing the heat to be conducted through the base metal. The fluxing action decreases near 600 deg F, so avoid overheating. The flux is slightly corrosive, so post soldering residue should be removed with hot water or other suitable cleaner.